unless the aerospace manufacturers have hangers full of leaded parts,
That's wholly wrong. I was only reading recently about studies on whisker growth
on tin plated component leads.
Ok, I should have been more precise. Even if there are only lead free
parts available you are still able to process them in a non-lead-free
process, which means you can easily coat your parts with a lead/tin
alloy. Comes automatically when you reflow SMD components with lead/tin
alloy, leaded parts may require special handling, if you mount them with
largely exposed leads - but standoffs might be anyway a good idea in
such a situation. The popular picture of the tin whisker on the crystal
lead shows a crystal with a rather unintelligent mounting position
anyway. Avoiding mechanical stress, i.e. bending, shouldn't be a big
deal if you adapt your production to a lead free process.
Besides that I just don't think it's appropiate to call RoHS for the
doomsday of all electronics. So far, the incidents on NASA's popular tin
whisker site seem rather exotic to me (a satellite for example is
working under ultra high vacuum, extreme temperature and high radiation
conditions). I don't know whether RoHS will be a more complex problem
than adapting to other production issues. So far I think chances are
rather high that you can control it in the same way as other production
issues. (How many failures of end products were caused because
production plants didn't stick to the correct soldering temperature
profile or didn't bake components correctly?)
Klaus