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[email protected]
- Jan 1, 1970
- 0
why is 63-37 eutectic solder not universally preferred?
why is 63-37 eutectic solder not universally preferred?
why is 63-37 eutectic solder not universally preferred?
why is 63-37 eutectic solder not universally preferred?
Because you can't sell it in the EU if it's got lead in it.
Because you can't sell it in the EU if it's got lead in it.
mike said:Because you can't sell it in the EU if it's got lead in it.
Not true at all. There are plenty of organisations that are still legally
allowed to use 60/40..... Schools colleges/military/telecoms/space etc. Plus
many more who don't care about lead free....
Because you can't sell it in the EU if it's got lead in it.
why is 63-37 eutectic solder not universally preferred?
Ecnerwal said:Because sometimes you want mush.
Eutectic is either solid, or liquid.
Formulations off eutectic have a range of mushiness, which can be of use.
And they have higher melting points, which can be of use in multipart
assemblies, where you might use 50-50, 60-40 and 63-37 to assemble and
solder a series of parts.
Interesting. I've not heard of this before. Do you speak from:
1> experience
2> rumor
3> speculation
Not wanting to be confrontational, just curious. Wikipedia lists melting
points as:
63/37: melts between 180-185°C
60/40: melts between 183-190°C
50/50: melts between 185-215°C
I'm not aware of any soldering process that is able to control
temperature so closely as to not melt one, while melting another of
those formulations. Can you elaborate?
When I worked as a process engineer for Sprague Electric Co, in the
early 70's, making capacitors and resistors, we used 95/5 solder, I
think it was tin/lead with a small amount of silver, to assemble the
capacitors and resistors.
One reason for that choice was so that the parts would withstand
normal 60/40 soldering when boards were assembled.
Like you, I have some doubts about the kind of close control that
would be needed to use mixes as close as the ones given.
mike said:Because you can't sell it in the EU if it's got lead in it.
....
Not wanting to be confrontational, just curious. Wikipedia lists melting
points as:
63/37: melts between 180-185°C
60/40: melts between 183-190°C
50/50: melts between 185-215°C
I'm not aware of any soldering process that is able to control
temperature so closely as to not melt one, while melting another of
those formulations. Can you elaborate?
...
Not wanting to be confrontational, just curious. Wikipedia lists melting
points as:
63/37: melts between 180-185°C
60/40: melts between 183-190°C
50/50: melts between 185-215°C
I'm not aware of any soldering process that is able to control
temperature so closely as to not melt one, while melting another of
those formulations. Can you elaborate?
Smitty Two said:If you're going to quote me, I'd appreciate it if you wouldn't snip all
contextual relevance out of the discussion. As it is, your post might
appear to the casual observer as bearing some relevance to the topic at
hand. It may be a response to the OP, but it certainly isn't relevant to
the sub-topic of sequential soldering using a variety of formulations.
I am indeed trying to discuss the original topic of the thread. The
original poster's question interested me, an nobody has responded to it.
why is 63-37 eutectic solder not universally preferred?
Lostgallifreyan said:Probably because the gradual solidification makes dry joints less likely.
I'm not even sure it it does make them less likely, but I bet it does
[email protected] wrote in [email protected]:
Probably because the gradual solidification makes dry joints less likely.
I'm not even sure it it does make them less likely, but I bet it does
because you're not relying only on ductility of a solid to maintain good
structure during thermal contraction. If the two metals in the alloy don't
solidify together, one can flow to fill pores that might form in the other,
or between the solder and the parts joined with it.