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Thermal vias in thermal pad of IC?

Harald Kapp

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Nov 17, 2011
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Normally we don't place vias into pads at all. During soldering, solder will penetrate into the hole and will be lost for soldering the pin to the pad.

A thermal via would be counterproductive: as it is thermally isolated from the pad it will reduce the heat transfer away from the IC to the PCB.

I advise to put the necessary vias outside the thermal pad.
 

OLIVE2222

Oct 2, 2011
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You can place thermal pad under via knowing that solder paste are not placed on the whole thermal pad surface but is spread in 4 (in this case) the room between each solder paste "island" is used to place via's (this avoid the soldering penetration mentionned by Harald Kapp)

check the PCB layout of the TI evaluation board here you will see that:

http://www.ti.com/lit/ug/snvu179/snvu179.pdf
 
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eem2am

Aug 3, 2009
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http://www.ti.com/lit/ug/snvu179/snvu179.pdf

thanks....the article (above) doesn't show solder paste islands, but I see what you mean.
There are definitely 4 vias under the LP8556 chip, as you say.
I am stil not sure that they have made a complex solder paste mask for that thermal pad. I agree that it seems to make sense.
 
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