A
Andrew Holme
- Jan 1, 1970
- 0
Any tips on ways to hand solder SO8 packages which have a GND pad
underneath? I'm doing a PCB layout for a hobby project using one of these
devices so I could for example put a large plated through via under the
device big enough to get my soldering iron tip into. Is that a bad idea?
The device is a high-speed prescaler which dissipates ~ 350mW. The GND pad
not only needs to be well grounded for RF but also needs a low thermal
resistance to remove all that heat.
My board is standard 2-layer FR4 with an almost continuous ground plane on
the bottom.
TIA
underneath? I'm doing a PCB layout for a hobby project using one of these
devices so I could for example put a large plated through via under the
device big enough to get my soldering iron tip into. Is that a bad idea?
The device is a high-speed prescaler which dissipates ~ 350mW. The GND pad
not only needs to be well grounded for RF but also needs a low thermal
resistance to remove all that heat.
My board is standard 2-layer FR4 with an almost continuous ground plane on
the bottom.
TIA