Hi all,
I have a coupe of questions:
i have a 6 layer pcb, the stack up is as follows
layer 1 - component (smd and through-hole) + tracking of analogue signals
layer 2 - gnd
layer 3 - inner track for digital signals i.e. spi, i2c
layer 4- inner track for digital signals i.e. spi, i2c
layer 5 - power i.e. 5v and 3v3
layer 6 - tracking low frequency signals - led driving
ideally i wanted to layer 4 as another gnd layer but couldnt do this due alot of componenets that needed to be tracked.
Please could some one explain if i need to stitch areas of copper to 0v from layers 4 and 6?
please could someone explain the difference between 1oz and 2oz copper i.e. what it means in terms of pcb design
thanks in advance
I have a coupe of questions:
i have a 6 layer pcb, the stack up is as follows
layer 1 - component (smd and through-hole) + tracking of analogue signals
layer 2 - gnd
layer 3 - inner track for digital signals i.e. spi, i2c
layer 4- inner track for digital signals i.e. spi, i2c
layer 5 - power i.e. 5v and 3v3
layer 6 - tracking low frequency signals - led driving
ideally i wanted to layer 4 as another gnd layer but couldnt do this due alot of componenets that needed to be tracked.
Please could some one explain if i need to stitch areas of copper to 0v from layers 4 and 6?
please could someone explain the difference between 1oz and 2oz copper i.e. what it means in terms of pcb design
thanks in advance