Sundance’s VCS-1 Processor: Addressing the Growing Needs of Sensor Technology
Sundance Multiprocessor Technology has introduced the VCS-1 processor, available as a comprehensive system that blends advanced hardware and software capabilities. The stack was specifically designed for applications involving VCS: vision, control, and sensors—per its namesake.
The Key Features of VadaTech’s VT931 MicroTCA Chassis Platform
VadaTech has announced its VT931, a 4U (i.e. 7 inches-high), rugged MTCA.1 Chassis Platform with 12 Advanced Mezzanine Card slots. It is specifically designed to be used in a lot of military, aerospace, industrial and transportation applications.
AVX’s Series of Poke-Home Wire-to-Wire Connectors
Wire-to-wire connectors are always best known for their simplicity and reliability. They have been used in the industrial market for years with traditional 2-piece (plug and socket) connector systems that require crimp and poke-wire terminations to connect electrical or electronic components.
Intel’s Pohoiki Beach CPU: The Next Milestone in Neuromorphic Chip Development
Intel’s second AI-powered chip, the Pohoiki Beach, is able to process data up to 1,000 times faster than a general-purpose CPU. The company announced the chip at the DARPA Electronics Resurgence Initiative Summit event in Detroit in July of 2019.
Cal Test CT4140A 4mm Fuse Adapter Prioritises User and Electrical Safety Measures
Cal Test Electronics has unveiled a new 4mm fuse adapter, setting their sights on ultimate flexibility and electrical safety. The CT4140A is designed to accommodate a variety of electrical applications, delivering on its potential as an essential tool for engineers.
Smiths Interconnect Waterproof M23 Circular Connector Series
Many industrial applications are in need of robust, waterproof interconnectors that can be used for submersible motors and pumps in underwater environments. Accordingly, it is also required that these connectors maintain the same high electrical and mechanical durability even under dry conditions.
Chirp Microsystems MEMS-based Ultrasonic Time-of-Flight Sensor for Automotive and Industrial Applications
A Time-of-Flight (ToF) sensor works by sending out a signal (usually ultrasound or light) and waiting for it to bounce back from an obstacle and return to the sensor. The distance to the object can then be calculated from the time it took for the signal to return.
STMicroelectronics’ X-NUCLEO-IKS01A3 MEMS and Environmental Sensor Evaluation Board
STMicroelectronics’ X-NUCLEO-IKS01A3 micro-electromechanical system (MEMS) and environmental sensor evaluation board is a miniature micro-mechatronic device designed for a broad range of sensor applications, as well as for prototyping and product evaluation.
STMicroelectronics and Arrow Electronics Development Board for Optimal Automotive Engine Performance
STMicroelectronics and Arrow Electronics join forces to launch the SPC5-L9177A-K02 ECU reference design, intended to support compliance with future emission standards for single and twin-cylinder electronic fuel-injected gasoline engines.
TE Connectivity Expands VAL-U-LOK Connectors for Higher Current Applications
TE Connectivity has recently expanded their VAL-U-LOK connector line to include high current 13 A connectors with a maximum 600VAC rating. This is a major addition to their existing portfolio of connectors and greatly expands its usefulness to higher power applications.
Pass Stress and High Temperature Test Requirements For ADAS Development with KEMET T598 Capacitors
Even though tantalum polymer capacitors have a lot of significant features like high volumetric efficiency, low equivalent series resistance, high capacitance, high ripple handling, etc, it has always been a great challenge to pass the Automotive Electronics Council's AEC-Q200 stress test...