P
Philip Newman
- Jan 1, 1970
- 0
Hi, I am designing a filter multiplexer on microstrip in Agilent's
ADS. At the top of the structure is a filter section that is
grounded. the last transmission line has dimensions W=169690mm
L=0.732294mm.
My question is this: To be grounded properly, the design can either
be taken to the edge of the substrate (where it can make contact with
the ground plane of copper) or a via can be drilled through the
substrate to the copper.
Question 1: Which option is better?
Quesiton 2: What dimensions of via's are available ie what do
manufacturers like to work with....
I am currently designing with a tapered via with D1=0.15mm and
D2=0.25mm
Any ideas and help would be most appreciaited
Phil
ADS. At the top of the structure is a filter section that is
grounded. the last transmission line has dimensions W=169690mm
L=0.732294mm.
My question is this: To be grounded properly, the design can either
be taken to the edge of the substrate (where it can make contact with
the ground plane of copper) or a via can be drilled through the
substrate to the copper.
Question 1: Which option is better?
Quesiton 2: What dimensions of via's are available ie what do
manufacturers like to work with....
I am currently designing with a tapered via with D1=0.15mm and
D2=0.25mm
Any ideas and help would be most appreciaited
Phil