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Testpoints in production using finepitch/BGA packages (mobile phones etc)

Discussion in 'Electronic Design' started by Klaus Kragelund, Jan 5, 2007.

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  1. Hi

    I am going to investigate if we can get some of the active components
    cheaper by going from standard packages (SOT-23 etc) to finepitch
    (SC70, BGA etc) and perhaps also save some space.

    I see one problem though. Our production test people like to have a lot
    of testpoints to do either functional tests (flying probe) or ICT (In
    Circuit Test - impedance).

    But, going to finepitch means we no longer have space for the
    testpoints - and the production cant measure on the SMD leads/pads.

    Today I took two old standard mobile phones and did some reverse
    engineering. They seem to have very few testpoints. So I wonder - can
    anyone with experience in high integration devices tell me how they do
    ICT? Boundary scan or another fancy way?



    PS See picture of the mobile phones here (Nokia 3210 and Siemens
  2. ).
    Almost certainly JTAG
  3. PeteS

    PeteS Guest

    Probably boundary scan, although some devices have a NAND chain
    internally for testing too.


  4. PeteS skrev:
    Ok - so the next question:

    For analog stuff with high integration, do you place testpoints to be
    able to find any failed part in the ICT test (almost all nodes needs to
    be testpoints) - or do you rely on vision systems, functional tests or
    another method?


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