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Solid State Relays and EMI

D

David Harper

Jan 1, 1970
0
Arie de Muynck said:
Did you alrady do the test with the 1nF between driver size and output side?

Regards,
Arie de Muynck

Which pins are you suggesting I apply it across? Input ground to output ground?

Dave
 
A

Arie de Muynck

Jan 1, 1970
0
"David Harper" ...
"Arie de Muynck" ...
side?

Which pins are you suggesting I apply it across? Input ground to output
ground?


Yes. The basic idea is to minimize the RF voltage occurring across the
isolation barrier by shorting it with the cap.
Input GND to output GND is best, to other points it might cause other EMC
problems.

It _may_ help to also put a ceramic 1nF cap across the output. This lowers
the RF voltage across the FETs, half of which would be present at the output
side of the isolation barrier. But it will decrease the output impedance,
so it's a second choice solution only.

Regards,
Arie de Muynck
 
L

legg

Jan 1, 1970
0
Which pins are you suggesting I apply it across? Input ground to output ground?

I think he meant to the common terminal (pin5), from various places in
the circuit, including possibly an input drive rail.

RL
 
T

Tim Shoppa

Jan 1, 1970
0
Chris S. said:
I wouldn't necessarily classify MEMS devices as solid-state. While
certain types make use of "bending" to move small actuators, they still
rely on this movement to perform their function. The characteristic I
typically associate with solid-state is a lack of dependence on physical
motion to function.

Tubes move electrons to function, semiconductors move holes to function :).

Tim.
 
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