Mariano said:
So how did you do it then? you forgot to tell us how
No, I did tell you (at least, I did tell you those things)... here's my
original relevant sections pasted in again:
solder
As for process:
This TSSOP had 24 pins (unfortunately the catalogue had claimed in was DIL,
but in reality it was SMD. Pity I didn't read the datasheet carefully enough
and match up the part numbers).
So anyway, I carved two columns of small pads on the surface of the unetched
PCB using a knife (one of those ubiquitous dirt cheap orange "craft"
knives). 2 columns of 6 on each side of the chip, makes 24. I couldn't do 12
per side because they would have been too narrow for me to cut with that
knife. I left a space in between the pairs of columns either side, for the
IC.
The IC was glued in position. Now alternate pins on the TSSOP are bent
upwards. So considering the left hand side, pins 1, 3, 5, 7, 9, 11 continue
resting on the newly carved first column of 5 pads. Pins 2, 4, 6, 8, 10, 12
are bent upwards away from the board. Then I took ordinary multi-core wire,
and took single copper strands from it. These pins 2, 4, 6 etc were
connected to the outer column of 6 pads using these thin copper strands.
Bending alternate pins of the IC in opposite directions makes it possible to
solder to the pins even with this 1mm iron bit.
Have another look at the picture,
http://www.hanssummers.com/electronics/equipment/spectrumanalyser2/index.htm
and you will be able to see some of the things I'm talking about (the
columns of carved pads etc).
Hans
http://www.HansSummers.com