A
alb
- Jan 1, 1970
- 0
Hi all,
I'm not sure this is the good place where to post this, please advise a
better NG in case it exists.
I'm working on the soldering process of a component with phosphor bronze
pins onto a fairly standard FR-4 multilayer PCB. The component is a
light detector (MPPC: Multi Pixel Photon Counter) and I still do not
know what is the amount of heat to deal with.
Is there any recommendation on soldering this components on a pre-tinned
pad?
Anything special on thermal behavior which should be considered? For
instance I have seen a power mosfet mounted without stress release on
the soldering point on a the thru-hole one-sided pad that after several
ON/OFF cycles caused the joint to crack.
Any hint is appreciated.
Al
I'm not sure this is the good place where to post this, please advise a
better NG in case it exists.
I'm working on the soldering process of a component with phosphor bronze
pins onto a fairly standard FR-4 multilayer PCB. The component is a
light detector (MPPC: Multi Pixel Photon Counter) and I still do not
know what is the amount of heat to deal with.
Is there any recommendation on soldering this components on a pre-tinned
pad?
Anything special on thermal behavior which should be considered? For
instance I have seen a power mosfet mounted without stress release on
the soldering point on a the thru-hole one-sided pad that after several
ON/OFF cycles caused the joint to crack.
Any hint is appreciated.
Al