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ROHS - PCB fabrication choices

Discussion in 'Electronic Design' started by Al Clark, Jul 22, 2005.

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  1. Al Clark

    Al Clark Guest

    Like just about everyone else, we are looking the how we are going to
    migrate to lead free manufacturing.

    Our pcb fabricator currently offers Chemical Ni/Au plated or OSP pcbs.

    In our case, we use a mixture of hand soldering (SMT) and automation.

    My only experience with tin plating was horrible.

    Does anyone have a strong point of view on this topic?
     
  2. Pooh Bear

    Pooh Bear Guest

    Do elaborate.

    Yup.

    RoHS is a piece of crap with regard to electronics manufacture. The
    telecoms industry, and network and server ppl being let off the hook is a
    disgrace.

    Lets face it, if *they* can't make stuff work reliably lead free, who can
    ?

    I gather tin whiskering still isn't fully understood.

    Graham
     
  3. Al Clark

    Al Clark Guest

    The whole world is being forced to move to lead free (Thank you EU). This
    is going to create a whole lot of problems in my view that go beyond
    soldering. For example, I have already seen some legacy products
    discontinued just because the manuafacturer doesn't want to repackage the
    part. They might have continued the part if they weren't forced to go
    lead free.

    Almost all of us compete in a world market. This means that everything
    will move to lead free since we can't avoid Europe. The network guys, etc
    have the advantage that they can still use lead solder and solder plating
    on their pcbs.

    I agree that ROHS sucks and will probably cost our industry many billions
    of $, euros, etc.

    Nevertheless, we are still forced to comply. So I go back to my original
    question:

    Ni/Au, OSP or ?
     
  4. PeteS

    PeteS Guest

    As one who moved back to my native UK a year ago, I had to come up to
    speed on ROHS in a hurry (and made all the mistakes one might expect).

    For BGA packages, I use Ni/Au finishes (because they have better
    coplanarity characteristics) which work well for IR reflow, I have had
    no failures due to soldering failures within 6 months [I know that's
    not a long time] using lead free lines with this finish, although I am
    using a CM that invested in the proper line equipment.
    As I rarely have anything without a BGA, that's my preferred finish.

    It *is* more expensive, but the cost is coming down.

    There is a report by AMD on this subject:

    http://www.amd.com/us-en/assets/con...ets/Pb-free_Board-level_reliability_study.pdf

    Cheers

    PeteS
     
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