R
Robert Baer
- Jan 1, 1970
- 0
Seems that an IC could be "banned" if the leadframe *plating* (their
"material") has more than 0.1% of lead even tho the over-all percentage
of lead for the IC might be 0.01%.
Is this a correct interpretation?
However, the plating could be pure lead and the IC would "pass"
because that could be considered a high melting point solder even tho
the over-all percentage of lead for the IC might be (say) 1%.
Is this a correct interpretation?
And..what solder is "high melting point" solder?
Where is the "boundary"?
"material") has more than 0.1% of lead even tho the over-all percentage
of lead for the IC might be 0.01%.
Is this a correct interpretation?
However, the plating could be pure lead and the IC would "pass"
because that could be considered a high melting point solder even tho
the over-all percentage of lead for the IC might be (say) 1%.
Is this a correct interpretation?
And..what solder is "high melting point" solder?
Where is the "boundary"?