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Replacement of obsolete components

Discussion in 'Electronic Design' started by [email protected], Mar 12, 2009.

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  1. Guest

    Hi,

    I'm looking for some guidelines regarding replacement/substitution of
    obsolete components in our products.

    Currently the procedure is as follows:
    Passive components are evaluated by datasheet, and replaced without
    testing in case of matching data.

    Semiconductors are evaluated by datasheet, and tested in 5 pcs. of the
    product.

    The test is a standard functional production test, which basically
    consists of a verification of the functionality; signal levels, band
    widths, memory addressing etc. No temperature cycling, EMC test or
    burn in is performed.

    My worry is, that you in case of e.g. a die schrinked SRAM or uP, you
    might reduce your margin to an unacceptable level, making the product
    more sensible to EMC, temperature or what ever...

    How is this qualification done in the industry? E.g automotive?

    Thanks

    Jesper
     
  2. It's entirely up to each individual company, case-by-case, and in many cases
    up to the whim of individual departments/people within companies. There is
    no rule of thumb or industry standard qualifications, but different
    components may require as much trouble as formal product re-verification
    (e.g. EMC, safety standards, specific industry standards etc)

    For most apps you can pretty much get away safely with data sheet
    comparisons and standard functional tests as you have done. Some components
    and circuits are obviously more likely to cause issues than others, by
    orders of magnitude. It really comes down to the design engineers judgment.

    Dave.
     
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