I am trying to rework some PCBs which have pogo pins that are attached to large metal planes with varying amounts of success. I have a high temperature tip however, when melting the solder while pulling the pins from the other side of the board, some of the pads lift.
I have tried using flux, a desoldering pump and desoldering braid. The easiest method seems to be, to leave the existing solder and apply flux. Heating the solder seems to transfer a good amount of heat to remove the pin.
Is there a better technique to do this?
How can I ensure that the hole for the new pogo pin is clear of any solder?
Thanks!
I have tried using flux, a desoldering pump and desoldering braid. The easiest method seems to be, to leave the existing solder and apply flux. Heating the solder seems to transfer a good amount of heat to remove the pin.
Is there a better technique to do this?
How can I ensure that the hole for the new pogo pin is clear of any solder?
Thanks!