Connect with us

package parasitic models for Spice

Discussion in 'Electronic Design' started by Paul Burridge, Aug 16, 2004.

Scroll to continue with content
  1. Hi all,

    For multi-gigahertz analysis, a regular Spice model of the chip/die
    properties alone is of little use. You need to incorporate the device
    package's parasitic properties, too. But these don't seem to very easy
    to come by. Does anyone know of any sites where these additional model
    parameters for UHF+ analysis can be found?

    Thanks,

    p.
     
  2. Robert

    Robert Guest

    Depends on what package you choose. Most of the package suppliers have
    simple spice models of the ones they offer.

    Dean Monthei's book, has quite a few spice models for common package types
    as well.

    Robert
     
  3. Eh? Are you saying that dies and their packages are made by different
    suppliers? I'd always assumed the transistor manufacturer also made
    the packages for its dies, albeit to an industry-wide specification.
    Who manufactures the packages, then?
     
  4. legg

    legg Guest

    You might find what you need in some of these. If you care to identify
    the particular package that you are interested in, it might help.

    "Package lead inductance considerations in high-speed applications"
    Stephen C. Hinkle, Jeffrey A. West
    Philips AN212 '87
    http://www.philipslogic.com/support/appnotes/logic/pdf/an212.pdf

    Electrical Performance of Packages
    Nat Semi AN1205 '01
    http://www.national.com/an/AN/AN-1205.pdf

    DE-SERIES FAST POWER MOSFET
    George J Krausse,
    Directed Energy, Inc. Doc #9300-0002 Rev 2 '00
    http://www.ixysrf.com/pdf/switch_mode/appnotes/2de_series_intro.pdf

    DE-Series MOSFET, DEIC420 And SOP-28 IC Device Installation & Mounting
    Instructions
    IXYS Doc #9300-0005 Rev 3 '03
    http://www.ixysrf.com/pdf/diodes/app_notes/7de-series_mosfet_installation_instructions.pdf


    "Lumped Skin Effect Model for Package Leads"
    A.E.Engin
    IBIS'03
    http://www.eda.org/pub/ibis/summits/feb04b/engin.pdf

    RL
     
  5. Robert

    Robert Guest

    Yep. A lot of the packages moved offshore quite a while ago to the Assembly
    houses in the Asian area. Thailand, Singapore, and others take the die from
    the IC manufacturers and wirebond it into the various packages. Or
    wedgebonds or ballbonds or ...

    Do a google on Assembly IC packages and you should see a few of their sites.

    Robert
     
  6. [useful links snipped]

    Thanks for the links.
    Okay. I'm only talking about RF transistors here; nothing more
    complicated than that. No specific package, but rather a variety of
    the common types that are mostly used for encapsulating RF trannies.
     
  7. legg

    legg Guest

    I would expect that devices specifically designed to be applied in RF
    applications will have these strays, as present in the recommended
    board layout, in their manufacturer-generated models.

    The only problem is with 'misapplied' devices in conventional
    packaging.

    If you have an application, then you will have a list of candidates
    with specific package types that need to be addressed.

    RL

    RL
     
Ask a Question
Want to reply to this thread or ask your own question?
You'll need to choose a username for the site, which only take a couple of moments (here). After that, you can post your question and our members will help you out.
Electronics Point Logo
Continue to site
Quote of the day

-