Connect with us

Is there really any difference between MC33063A and MC34063A?

Discussion in 'Electronic Components' started by [email protected], Feb 27, 2008.

Scroll to continue with content
  1. Guest

    As far as I can see from the OnSemi datasheet, the MC33063ADR2G and
    MC34063ADR2G are totally identical except for the specified
    temperature range (-40 to +85degC vs 0 to +70degC).

    Does anyone know of any physical difference between them, such as
    altered package construction or materials?

    Are the the 33063 devices actually tested at the -40 and +85degC
    temperature extremes, or is the difference purely a way of promoting
    the device for different market segments (with appropriate cost
    adjustments)?

    John
     
  2. Jim Thompson

    Jim Thompson Guest



    Heck No! In terms of functionality, The -40 to +85degC is for Military
    application, the other one for commercial use. It said very loud and clear
    in the databook.


    ...Jim Thompson
    --
    | James E.Thompson, P.E. | mens
    |
    | Analog Innovations, Inc. | et
    |
    | Analog/Mixed-Signal ASICK's and Discrete Systems | manus |
    | Phoenix, Arizona Voice:(480)460-2350 | |
    | E-mail Address at Website Fax:(480)460-2142 | Brass Rat |
    | http://www.analog-innovations.com | 1962 |

    America: Land of the Freedom Abusers, Because of the Bastards.
     
  3. Fred Bloggs

    Fred Bloggs Guest


    Dunno offhand but this surely warrants serious and detailed study, we'll
    get back to you...Have you checked the reliability and process screening
    links?
     
  4. Guest

    get back to you...Have you checked the reliability and process screening
    Yes, I have now! Thanks for that pointer.

    I compared the following parameters for the MC34063ADR2G (0 to +70),
    MC33063ADR2G (-40 to +85) and MC33063AVDR2G / NCV33063AVDR2G (-40 to
    +125) automotive published on the On-Semi website:

    Wafer fab process
    Reliability data
    Mold compound composition
    Lead frame composition
    Die attach composition
    Plating composition
    Wire bond composition

    Everything is identical for all temperature variants of the device.

    So that answers the question about physical differences - there appear
    to be none.

    What I can't find is anything to tell me whether the devices are
    ACTUALLY tested at temperature extremes.

    John
     
  5. On Wed, 27 Feb 2008 09:32:09 -0800 (PST), the renowned
    They may be tested to tighter standards at room temperature, so that
    they will still meet specs at temperature extremes. Why do you care?



    Best regards,
    Spehro Pefhany
     
  6. Guest

    That sounds plausible.

    The application is highly cost sensitive and requires very occasional
    operation down to -20 deg C and up to +80deg C (including self-heating
    of the housing). The vast majority of the time will be spent between
    +10 and +50 deg C.

    Parametric deviations at temperature extremes of up to twice the
    specified limits would not cause a problem.

    John
     
Ask a Question
Want to reply to this thread or ask your own question?
You'll need to choose a username for the site, which only take a couple of moments (here). After that, you can post your question and our members will help you out.
Electronics Point Logo
Continue to site
Quote of the day

-