Hi MrWho,
The t° can be found in the solder manufacturer datasheet however for such kind of component hot air is probably not the best solution (it takes too long time for the heat to melt the solder). better to (without dedicated reworking station) :
* made a big fresh solder blob on one row that shortcut the 4 pin's
* heat the blob and carefully raise the package with an adapted tool till the pin's are isolated from the pads. You must ensure a good melting to avoid any pad's damage when pulling !!
*made a big fresh solder blob on the other row and kick the board a bit to let the eeprom fail.
*clean the pin's and re-align them
If the eeprom content is very important you can maybe try to read it before desoldering for backup purpose. You must be fast to desolder, so maybe you can train yourself with
any dead board.
Olivier