Creating Thermal Vias?

[Pavan R Nyama]

Hi,

I have a board with a copper pour on both the top and bottom layers,
and i want to place a via for thermal reasons. However, i dont want to
have the ring of no copper around the via - i essentially want to
create a plated hole straight through the board without changing
anything else on either layer. Does anyone have any suggestions on how
to do this?

Im using Altium 6, so application specific help would be even more
appreciated

 

[legg]

Hi,

I have a board with a copper pour on both the top and bottom layers,
and i want to place a via for thermal reasons. However, i dont want to
have the ring of no copper around the via - i essentially want to
create a plated hole straight through the board without changing
anything else on either layer. Does anyone have any suggestions on how
to do this?

Im using Altium 6, so application specific help would be even more
appreciated

Asign both copper pours to the same netlist node.

Remove any thermal relief from the pth's or via's selected pattern.

RL

 

[qrk]

Hi,

I have a board with a copper pour on both the top and bottom layers,
and i want to place a via for thermal reasons. However, i dont want to
have the ring of no copper around the via - i essentially want to
create a plated hole straight through the board without changing
anything else on either layer. Does anyone have any suggestions on how
to do this?

Im using Altium 6, so application specific help would be even more
appreciated

This is called "flooding" in some schools. Basically, have a pad
connect to a plane without thermal relief. This might be an option in
the pad definition.