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Comments on this sil-pad?

Discussion in 'Electronic Design' started by Tim Williams, Jun 17, 2007.

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  1. D from BC

    D from BC Guest

  2. Mook Johnson

    Mook Johnson Guest

    Depends on the application. if low thermal resistance is required, better
    to go with the white stuff as think as possible. If its not so criticla but
    you need some thermal contact to keep moderately warm components cooler and
    you don't want the tight tolerance issued of chassis mounted components, it
    is pretty good.

    We use it on the opposite side of some D2PAC mosfets. Peppered the board
    with thermal vias and put the pad under the board. 10 degrees C lower
    temperature than without.
     
  3. Ross Herbert

    Ross Herbert Guest

  4. Fred Bartoli

    Fred Bartoli Guest

    Tim Williams a écrit : I used that to cool a low inductance 1mR PCB shunt (20x10mm) carrying up
    to 150A and dissipating up to 22W!

    Worked like a charm, but this reminds me something: don't make the same
    mistake the prod guys did. When the board went to prod they forgot to
    peel off the protective sheets on the first one: pzzzt, pofff... three
    fully mounted 12 layers 20x15" ($3k each) going to dump at final test.
     
  5. Eeyore

    Eeyore Guest

  6. Tim Williams

    Tim Williams Guest

    My brevity fails me...

    To insulate two heat spreaders, 1.5 x 3" copper. Alternately, just
    insulating a pair of TO-247's, but I get the feeling 4.5 in^2 is a somewhat
    better footprint, besides which I already have it set up that way.

    White goop would be fine, except that I need to stand off 360V minimum (the
    transistors are rated for 600V, so more than that would be good).

    Tim

    P.S. Oops, looks like I CTRL+R'd this post a few days ago, instead of
    CTRL+G...

    Deep Fryer: A very philosophical monk.
    Website @ http://webpages.charter.net/dawill/tmoranwms

    ----- Original Message -----
    From: "Eeyore" <>
    Newsgroups: sci.electronics.design
    Sent: Monday, June 18, 2007 4:20 AM
    Subject: Re: Comments on this sil-pad?
     
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