Please posts your questions and answers from anything from MOS device theory, processing, and design. I'd like to see what comes of it. I'm not exactly an expert in VLSI but I'm always looking to know more. Someone asked me a simple question the other day concerning the limitation of increasing the power supply to reduce delays. My explanation is that once you increase the supply voltage at the drain terminal, the depletion region should extend to the source. This means there should be no carriers at the surface for conduction in the channel area. Thus carriers are swept across the channel to the source independently of gate voltage(i.e. when vgs=0) at the saturation velocity. Someone verify if this is the limitation. This condition should be avoided however...... at submicron level, such small geometries invite punchthrough and hot carrier problems. Can someone explain how to avoid these problems say for 5V supply? I know that by grading the doping concentration away from the oxide is one way of getting rid of hot carrier problems. Another possible solution could be reduce the internal circuit voltages so that these problmes do not arise. Any input would be appreciated.