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Chip (wafer) bonding proccess.

Discussion in 'Electronic Design' started by [email protected], Apr 14, 2006.

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  1. Guest

    How does bonding machines make wires between the package pins and chips to
    attach ..?
  2. John_H

    John_H Guest

    You can probably find online descriptions. That aside, there's a
    combination of ultrasonic vibration (scrubbing) and heat applied to the
    wire fed through a small ceramic capillary tube. The resulting
    metal/metal bond is pretty strong.
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