S
Spaceghost
- Jan 1, 1970
- 0
Hi, in my past experience with I/O, it's been digital...the pad was from an
IP provider, and had ESD protection. I'm working in the analog world now,
and am wondering how you are supposed to get the signal into the chip. I
mean, do you just directly wire from the bond pad to say, the input terminal
of your op-amp? I guess I'm trying to figure out if any special I/O or
protection circuitry is needed.
Thanks,
Marc
IP provider, and had ESD protection. I'm working in the analog world now,
and am wondering how you are supposed to get the signal into the chip. I
mean, do you just directly wire from the bond pad to say, the input terminal
of your op-amp? I guess I'm trying to figure out if any special I/O or
protection circuitry is needed.
Thanks,
Marc