How about copper pour what do you recommend?
On two sided boards, you can pour the ground/power plane if it works/suits your design, but in general most of my 'pours' on two sided boards is simply for heat sinking purposes... Or if you are home etching to save etchant, but since I no longer bother etching my own stuff this doesn't factor in anymore...
There are reasons you would want to do pours and they do pay off in providing shielding in some cases but it's overkill in most applications...
There are lots of articles on pours all over the Internet that go into much more detail, but this PDF gives a quick and dirty overview...
http://www.icd.com.au/articles/Copper_Ground_Pours_AN2010_4.pdf
And last but not least, sometimes pours 'look cool' I have been known to layout/define boundaries and pour designs just because... I have also been known to use pours to 'highlight' and 'create' text or graphics on the bottom of a board instead paying for a bottom silk... Same on the top of a board, sometimes the contrast of test written in the copper layer vs the silk is nice looking or more permanent... Consider this on the top of a board for 'highlighting' something... Using creativity you can get quite a bit of definition and highlight using the silkscreen layer, the 'poured' layer, the 'bare pcb' layer, and the exposed copper 'pad' layer, especially nice now that ROHS kicked in and gold plating has made it's way to mainstream or at least very cost competitive... Think black (or another dark color) board with gold text, or even silver text