J
Jon Slaughter
- Jan 1, 1970
- 0
Why are circuits not layed in 3D to produce fast amounts of gates? If you
take your average memory circuit such as SRAM and "layer" it as high as it
is wide then you'll get a huge increase.
What is the difficulties in doing such things? I imagine heat dissipation
would be a big problem but maybe one can add in "heat pipes" to carry the
heat from the inner layers. If one has a matrix of 1000x1000 cells for a 1Mb
memory then repeating that in the "z" dimension would give a 1Gb
memory.(sure it would be square and bulky but thats not the point)
Now maybe they already do this to some degree but I've never seen it
mentioned. Maybe it's difficult to layer the substraits together?
I was thinking that a true 3D method would be optimial for density reasons.
If a potential solid substance could be created where one could apply a
laser of difficult wave lengths to get different properties such as a
conductor or semi-conductor then one might be able to make truely 3D
circuits. Similar to 3D printing. The laser heats the material in such a way
as to turn it into a conductor or semiconductor. It is built up in a
continuous manner. Anyways... just an idea. Not saying it is practical but
just the abstract idea would work.
But I don't even see devices that use true "layering" techniques. I do
realize that in some sense standard semiconductor fabrication uses
"layering" but they only have one substrate layer? If one could layer, say,
fpga cores then they would become vastly more powerful.
Anyways, just something I was wondering about...
take your average memory circuit such as SRAM and "layer" it as high as it
is wide then you'll get a huge increase.
What is the difficulties in doing such things? I imagine heat dissipation
would be a big problem but maybe one can add in "heat pipes" to carry the
heat from the inner layers. If one has a matrix of 1000x1000 cells for a 1Mb
memory then repeating that in the "z" dimension would give a 1Gb
memory.(sure it would be square and bulky but thats not the point)
Now maybe they already do this to some degree but I've never seen it
mentioned. Maybe it's difficult to layer the substraits together?
I was thinking that a true 3D method would be optimial for density reasons.
If a potential solid substance could be created where one could apply a
laser of difficult wave lengths to get different properties such as a
conductor or semi-conductor then one might be able to make truely 3D
circuits. Similar to 3D printing. The laser heats the material in such a way
as to turn it into a conductor or semiconductor. It is built up in a
continuous manner. Anyways... just an idea. Not saying it is practical but
just the abstract idea would work.
But I don't even see devices that use true "layering" techniques. I do
realize that in some sense standard semiconductor fabrication uses
"layering" but they only have one substrate layer? If one could layer, say,
fpga cores then they would become vastly more powerful.
Anyways, just something I was wondering about...